Hsinchu, Taiwan – (BUSINESS WIRE) – TSMC (TWSE: 2330, NYSE: TSM) will showcase its latest innovations in advanced logic, specialty, and TSMC 3DFabric ™ advanced packaging and chip stacking technologies at the company’s 2021 Technology Symposium. The symposium is online for the second year and connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphones and WiFi 6 / 6e performance, N5A for cutting-edge automotive applications, and improvements across the 3DFabric technologies. Over 5,000 customers and technology partners around the world have registered for our Technology Symposium 2021, which will take place from 1.
“Digitization is changing society faster than ever as people use technology to break the barriers created by the global pandemic, to connect, collaborate and solve problems,” said Dr. CC Wei, CEO of TSMC. “This digital transformation has opened up a new world of opportunity for the semiconductor industry. Our global technology symposium shows many ways in which we can improve and expand our technology portfolio in order to unleash our customers’ innovations. ”
Advanced technology leadership – N5, N4, N5A and N3
TSMC was the first in the industry to bring 5 nanometer (nm) technology to mass production in 2020, with defect density improving faster than the previous 7nm generation. The N4 The expansion of the 5 nm family further improves performance, energy efficiency and transistor density, along with the reduction of mask layers and the close compatibility of the design rules with N5. The development of TSMC N4 has gone smoothly since it was announced at the 2020 Technology Symposium, with risk production scheduled for the third quarter of 2021.
TSMC presents N5A, the newest member of the 5nm family; The N5A process aims to meet the growing demand for computing power in newer and more intensive automotive applications such as AI-enabled driver assistance and the digitization of vehicle cockpits. N5A brings the same technology used in supercomputers today into vehicles, delivering the performance, energy efficiency and logic density of N5 while meeting the stringent quality and reliability requirements of AEC-Q100 Grade 2 and other automotive safety and quality standards. TSMC N5A is powered by the thriving TSMC Automotive Design Enablement Platform and is expected to be available in the third quarter of 2022.
TSMCs N3 Technology is expected to be the most advanced technology in the world when it goes into mass production in the second half of 2022. Based on the proven FinFET transistor architecture for best performance, energy efficiency and cost efficiency, N3 will offer a speed increase of up to 15% or consume up to 30% less power than N5 and offer up to 70% logic density gain.
Advanced radio frequency technology for the 5G era – N6RF
5G smartphones require more silicon area and consume more power to provide higher wireless data rates compared to 4G. 5G-capable chips integrate more functions and components and are getting bigger and bigger and compete with the battery for a limited space in the smartphone.
TSMC introduced the N6RF process, which brings the power, performance and area benefits of its advanced N6 logic process to 5G radio frequency (RF) and WiFi 6 / 6e solutions. At 16 nm, N6RF transistors achieve more than 16% higher performance than the previous generation of RF technology. Additionally, N6RF supports significant power and area reductions for 5G RF transceivers for both sub-6 gigahertz and millimeter wave spectrum bands without compromising performance, features and battery life for consumers. TSMC N6RF will also improve the performance and energy efficiency of WiFi 6 / 6e.
TSMC 3DFabric system integration solutions
TSMC continues to expand its comprehensive 3DFabric family of 3D silicon stack and advanced packaging technologies.
For high performance computing applications, TSMC offers larger reticles for InFO_oS and CoWoS® Packaging solutions in 2021, which enables larger floor plans for chiplet and memory integration with high bandwidth. In addition, the chip-on-wafer (CoW) version of TSMC-SoIC ™ will be qualified to N7-on-N7 this year, with production planned for 2022 in a new fully automated factory.
For mobile applications, TSMC is introducing its InFO_B solution, designed to integrate a powerful mobile processor in a slim, compact package with improved performance and energy efficiency, and to support mobile device manufacturers’ DRAM stacking on the chassis.
TSMC pioneered the pure foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The company supports a thriving ecosystem of global customers and partners with industry-leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations in Asia, Europe and North America, TSMC serves as a dedicated corporate citizen around the world.
TSMC deployed 281 different process technologies and manufactured 11,617 products for 510 customers in 2020 by providing the widest range of advanced, specialized and advanced packaging technology services. TSMC is the first foundry to offer 5 nanometer manufacturing capabilities, the most advanced semiconductor process technology in the world. The company is headquartered in Hsinchu, Taiwan. For more information, please visit https://www.tsmc.com.