HONG KONG, June 24, 2021 / PRNewswire / – Hong Kong Applied Science and Technology Research Institute (ASTRI) congratulates its partner China Chippacking Technology Co., Ltd Science and Technology Innovation Council of Shanghai Stock Exchange today and is traded under the ticker symbol 688216.SH. Mr. Liang Dazhong, director of the board of directors of China Chippacking Technology, and his delegation rang the bell on June 23, 2021. As a strategic partner of Chippacking Technology, ASTRI was invited to the mutual listing banquet and Mrs. Tina Yang |, ASTRI’s Director of Mainland Strategy and Operations, was present.
ASTRI and Chippacking Technology have been partners for many years. Chippacking Technology is focused on providing customers with competitive packaging and testing products, while ASTRI’s Integrated Circuits and Systems (ICS) technology division is dedicated to researching and developing advanced packaging technologies. The parties have jointly developed many advanced packaging technologies and products, which have improved product performance and reduced packaging and testing costs. Joint projects between the two parties were developed and mass-produced on the pilot line for three-dimensional packaging in the Hong Kong Science Park. They were also the first mass production projects to be launched by the local advanced packaging pilot line in Hong Kong.
DR Lucas Hui, Deputy Co-CEO and Chief Technology Officer at ASTRI, and dr Martin Szeto, Acting Co-CEO and Chief Operating Officer, congratulated Chippacking Technology on its successful listing on the Shanghai Stock Exchange. Dr. Hui said, “We would like to extend our sincere congratulations to Chippacking Technology. We hope that Chippacking Technology and ASTRI will continue to develop innovative and technology projects in the future, contributing to the growth of the sector and the Greater Bay Area.”
Dr. Szeto said, “ASTRI is committed to developing market-driven and competitive solutions. We are excited about Chippacking Technology’s successful listing. We hope ASTRI will help our partners create more value in the future.”
Mr. Liang Dazhong said, “Chippacking Technology has been working with ASTRI to develop BGA and flip-chip packaging technologies since 2014. We have laid a strong foundation, but there is plenty of room for further collaboration. We are very grateful to ASTRI for his tireless work. ” Support, and we look forward to continuing our strong collaboration for further remarkable achievements. “
The Hong Kong Applied Science and Technology Research Institute (ASTRI) was established in 2000 by the Hong Kong SAR government with the aim of providing Hong Kong Competitiveness through applied research. ASTRI’s R&D core competency in various areas is grouped into five technology areas: AI and Big Data Analytics; Communication; Cybersecurity, cryptography and trusted technologies; Integrated circuits and systems; and IoT and sensors. It is used in the five core areas of Smart City, Financial Technologies, Intelligent Manufacturing, Digital Health and Application Specific Integrated Circuits.
Over the years, ASTRI has maintained a pool of research and I&T talent and has received numerous international awards for its groundbreaking innovations as well as outstanding contributions from business and society. To date, ASTRI has transferred over 750 technologies to the industry and has received more than 900 patents in the mainland, the United States, and other countries. For more information please visit www.astri.org.
Tina Yang |
Tel: (852) 3406 2555
SOURCE Hong Kong Applied Science and Technology Research Institute (ASTRI)